JES-F 3200 is a one-component organofluorosilicone gel that cures into a soft, self-cushioning material. It is used to isolate contact circuit boards from moisture, other harmful contaminants, and corrosive gases, and provides insulation against high voltage. Another application is stress relief, protecting circuits and interconnects from high temperatures and mechanical stress.

Single-component addition-type, direct dispensing; excellent flexibility, relieves mechanical stress; extremely low oil seepage after curing; excellent high-temperature electrical insulation, providing protection against high voltage; excellent aging resistance and weather resistance; excellent corrosion resistance, moisture resistance, and chemical resistance; suitable for semiconductor modules, connectors, sensors, etc.